The densification of electronic boards is pushing mechanical architectures to their limits. With FPGAs and processors demanding ever more I/O and higher speeds, internal connectors (Mezzanine and Backplane) have become the focal point of critical reliability challenges.
For the system architect, the equation is complex: how can pitch be reduced to save space without increasing the risk of failure under vibration?
Here is how Matr’YX and VITA 66 connectors technically address these constraints.